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                FMC

                产品特点

                • 基板厚度低不凡至0.1mm
                • 严格的基板平整↑度控制,阻焊油墨整平工艺
                • 软金/硬金电镀和硬金光亮度控制
                • 基板翘曲控々制

                产品规格

                • 40/35um芯板
                • 液态或干膜型阻焊

                产品应用

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